Stencil Stepping


Stepped stencils provide practical, workable solutions in a number of different applications:

  • Multilevel SMT stencils vary the foil thickness locally to improve paste release on fine features or increase volumes on large or through-hole prints
  • 3-D cavity stencils have topographies on the contact side to fit down into PCB cavities
  • BGA ball drop stencils often have “standoffs” built into the contact side to prevent sticky flux buildup on the stencil or in the apertures.
  • Semiconductor ball drop stencils are similar to BGA ball drop stencils, but far more precise due to their small scale

Stencils can be created by a variety of manufacturing processes. Chemical milling was the traditional process for years but is now considered obsolete* due to the technological advancements in welding and micromachining

Stencil Stepping
Product Inquiry

Login

Please enter your name and email address to login.

Please contact us if you do not have an account

Customer Name
Order History
Product Unit Price Quantity Total
Back to Order List

Customer Name

Order Details

null $0.00
Quantity: 0

Total

Taxes $0.00
Total $0.00

Repeat Order

You can change the quantity and address on next page.

Repeat Order

Confirm Order

Please enter your name, email and confirm your shipping address to complete your order of:

Repeat Order

Order Placed

Your order has been successfully placed.

Product Details

Welding locally changes the thickness of the foil by cutting identical slugs from the base stencil foil and the same material of a different thickness. The replacement piece is then welded into place in the base stencil before laser cutting. This is a very economical process for step ups and step downs. All Datum materials are compatible with laser welding processes.

 

Micromachining, or micromilling, uses a very precise CNC positioning system with very small, hard cutting tools to remove steel without distortion or burrs. It is the most flexible stepping method, able to create unlimited shapes, patterns, wall profiles and cavities. It is the most economical method of creating stencils with -multiple steps, or stencils that need contact side relief for board snuggers or labels. All Datum materials are compatible with micromilling; for walls as thin as 20 µm, Datum Tension is suggested.

Welding and machining can be used in combination to smooth transition walls, create print reservoirs or accommodate thickness differentials > 50 µm (2 mils).

Chemical milling is now considered obsolete because it is a highly variable process, which contributes to the poor quality and extends lead times. Due to its technological obsolescence and the wide-scale availability of welding and micromachining, Datum no longer supports chemical milling operations.

Resources

Visit Datum’s Support Library for a complete list of resources.

VIEW ALL RESOURCES

Stencil Stepping Datasheet 1

View Details

Stencil Stepping Datasheet 2

View Details