Wave Solder pallet Material - Case Studies
Datum’s wave solder pallet material, DCP, is composed of high-temperature glass fibre and high-performance epoxy resin, ensuring minimal fixture replacement and optimised productivity. Explore our case studies to see how the exceptional machinability and extended service life of our solder pallet material offer direct cost advantages to both pallet fabricators and PCB assemblers.
Datum DCP Solder Wave Pallet Material
Material comparison – why Datum DCP performs better during the machining and solder wave process than other forms of solder wave pallet material.
